ITEXPO In Progress
December 30, 2013

ITEXPO Miami Devotes Programming to Customer Interaction Solutions

Norwalk, CT – December 30, 2013 – TMC today announced its Customer Interaction Solutions programming track at ITEXPO Miami, held January 28-31, 2014, at the Miami Beach Convention Center in Miami, Florida. ITEXPO Miami is dedicated to the convergence of education, innovation and networking, delivering insight into the world of WebRTC, UC, BYOD, cloud computing, social media and much more. The Customer Interaction Solutions track of sessions focuses on strengthening the relationship between an organization and its customers through innovative technology, trends and techniques.

The Customer Interaction Solutions programming track will include discussion topics such as call centers, multi-channel communications, social engagement, digital storytelling, branding and more. Sessions included in the Customer Interaction Solutions track include:

  • From Call to Contact: The Next Generation Customer Service Center
  • Building Your 360-Degree Customer View
  • You Should Hear How She Talks About You: What’s in a Brand Reputation?
  • Digital Storytelling: Business Brands as Publishers
  • Creating Brand Advocates Through Contextual Customer Experience
  • Why Social is Critical to Customer Satisfaction
  • The Relationship Between Big Data and Customer Experience
  • Personalization for a Mobile and Social World
  • Best of All Worlds: New Face of Customer Service
  • The Power of Multimedia in Customer Engagement
  • What WebRTC Means for Customer Service
  • Language, Loyalty and Your Bottom Line
  • A Little Social Tuning is Music to CRM Ears
  • Strategies for Successfully Blending Human and Virtual Agents

“ITEXPO is a unique opportunity to learn about new technology, explore new customer interaction strategies and network with some of the best and brightest innovators in the industry,” said Rich Tehrani, TMC CEO and conference chairman. “Attendees return to ITEXPO each year to learn, collaborate and receive valuable insight into what the business technology industry may look like in the coming months and years.”

ITEXPO Miami is supported by Diamond Sponsor Digium; Platinum Sponsors AudioCodes, Content Boost, Interactive Intelligence, NETXUSA, Sansay, Yealink and 888VoIP; and Gold Sponsors ABP Tech, ADTRAN, ANPI, MegaPath, Nextiva, Sagemcom, Sangoma, snom, Taqua, Vitelity, Voxbone and Xmartek.

Registration is now open for ITEXPO Miami. For more information please contact Frank Coppola at 203-852-6800 x131. For media inquiries, contact Ashley Baster. Companies interested in exhibiting, sponsorship or advertising packages for ITEXPO Miami should contact TMC's Joe Fabiano at 203-852-6800 x132 or Maureen Gambino at 203-852-6800 x109.

For the latest ITEXPO Miami news, updates and information, follow on Twitter at @ITEXPO.       

About TMC
TMC is a global, integrated media company that supports clients' goals by building communities in print, online, and face to face. TMC publishes multiple magazines including Cloud Computing, M2M Evolution, Customer, and Internet Telephony. M2Mevolution is the leading source of news and articles for the communications and technology industries, and is read by as many as 1.5 million unique visitors monthly. TMC produces a variety of trade events, including ITEXPO, the world's leading business technology event, as well as industry events: Asterisk World; AstriCon; ChannelVision (CVx) Expo; Cloud4SMB Expo; Customer Experience (CX) Hot Trends Symposium; DevCon5 - HTML5 & Mobile App Developer Conference; LatinComm Conference and Expo; M2M Evolution Conference & Expo; Mobile Payment Conference; Software Telco Congress, StartupCamp; Super Wi-Fi Summit - The Global Spectrum Sharing and TV White Space Event; SIP Trunking-Unified Communications Seminars; Wearable Tech Conference & Expo; WebRTC Conference & Expo IV; and more. Visit TMC Events for additional information.

Media and Analyst Contact:       

Ashley Baster

Connect2 Communications         

(919) 435-9112  


Edited by Cassandra Tucker

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